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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/29 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 sound processors for home theater system s 4ch sound processor with built-in micro-step volume BD34700FV general description the BD34700FV is a 4ch independent volume system. micro-step volume can reduce the switching pop noise when volume changes, so it can achieve a high-quality set. it is most suitable for s ubvolume of the multi channel volume such as av receivers, but is most suitable for main volume of simple systems such as 2ch. features ? micro-step volume can reduce the switching pop noise when volume changes. ? micro-step volume can reduce the capacitor for the dc offset cut ? 2-wire serial bus control, corresponding to 3.3/5v. ? it is controllable to two chips on the same serial bus by using chip select terminal. applications ? most suitable for the av receivers, home theater and mini-component systems key features ? total harmonic distortion: 0.0004%(typ.) ? maximum output voltage: 4.2vrms(typ.) ? output noise voltage: 1.5uvrms(typ.) ? residual output noise voltage: 1.0uvrms(typ.) ? cross-talk between channels: -105db(typ.) package w(typ.) x d(typ.) x h(max.) ssop-b40 13.60mm x 7.80mm x 2.00mm ssop-b40 typical application circuit figure 1. application circuit chip dgnd da cl
2/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 pin configuration figure 2. pin configuration vees 1 test 2 test 3 gnd 4 gnd 5 nc 6 vinl1 7 vinr1 8 vinl2 9 vinr2 10 gnd 11 gnd 12 gnd 13 chip 14 nc 15 vcc 16 dgnd 17 da 18 cl 19 vee 20 40 test 39 test 38 test 37 test 36 nc 35 nc 34 gnd 33 gnd 32 gnd 31 gnd 30 gnd 29 gnd 28 gnd 27 gnd 26 voutl1 25 voutr1 24 test 23 test 22 voutl2 21 voutr2 ssop-b40 (top view)
3/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 description of terminal terminal number symbol function terminal number symbol function 1 vees negative power supply terminal 21 voutr2 volume output terminal r2 2 test test terminal 22 voutl2 volume output terminal l2 3 test test terminal 23 test test terminal 4 gnd analog ground terminal 24 test test terminal 5 gnd analog ground terminal 25 voutr1 volume output terminal r1 6 nc non connection 26 voutl1 volume output terminal l1 7 vinl1 volume input terminal l1 27 gnd analog ground terminal 8 vinr1 volume input terminal r1 28 gnd analog ground terminal 9 vinl2 volume input terminal l2 29 gnd analog ground terminal 10 vinr2 volume input terminal r2 30 gnd analog ground terminal 11 gnd analog ground terminal 31 gnd analog ground terminal 12 gnd analog ground terminal 32 gnd analog ground terminal 13 gnd analog ground terminal 33 gnd analog ground terminal 14 chip chip select 34 gnd analog ground terminal 15 nc non connection 35 nc non connection 16 vcc positive power supply terminal 36 nc non connection 17 dgnd digital ground terminal 37 test test terminal 18 da data and latch input terminal 38 test test terminal 19 cl clock input terminal 39 test test terminal 20 vee negative power supply terminal 40 test test terminal
4/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 block diagram figure 3. block diagram
5/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 absolute maximum ratings item symbol rating unit positive power supply vcc +7.75 (note1) v negative power supply vee -7.75 (note1) v power dissipation pd 1.12 (note2) w input voltage vin vee-0.2 to vcc+0.2 v operating temperature topr -40 to +85 (note3) c storage temperature tstg -55 to +150 c (note1) the maximum voltage that can be applied based on gnd. (note2) this value decreases 9.0mw/c for ta=25c or more. a standard board, 70701.6 mm, shall be mounted. (note3) if it within operation voltage range, circuit functions operation is guaranteed within operation temp. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection meas ures, such as adding a fuse, in case the ic is operate d over the absolute maximum ratings. operating condition item symbol rating unit positive power supply vcc +6.5 to +7.5 (note4,5) v negative power supply vee -6.5 to -7.5 (note4,5) v (note4) applying a voltage based on gnd. (note5) within operation temp range, basic circuit function operation is guaranteed within operation voltage range. but please confirm set up of constant and element, voltage set up and temp set up on use. please watch out except condition stipulated by electrical characteristics within the range, it cannot guarantee standard value of electrical characteristics. but it retains original function .
6/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 electrical characteristic unless specified particularly, ta=25c, vcc=7v, vee=-7v, f=1khz, vin=1vrms, rl=10k ? , stereo input =vinl1,vinr1, stereo out put=voutl1,voutr1, volume=0db. item symbol limit unit conditions min. typ. max. total positive circuit current iqp - 22 44 ma no signal negative circuit current iqn -44 -22 - ma no signal output voltage gain gv -1.5 0 1.5 db 21,22,25,26pin output channel balance cb -0.5 0 0.5 db l channel reference, total harmonic distortion thd - 0.0004 0.02 % bw=400 to 30khz 21,22,25,26pin output maximum output voltage vom 3.8 4.2 - vrms thd=1%, volume=+10db 21,22,25,26pin output output noise voltage vno - 1.5 10 vrms rg=0 ? , bw=ihf-a 21,22,25,26pin output residual output noise voltage vnor - 1 8 vrms volume=mute, rg=0 ? , bw=ihf-a 21,22,25,26pin output cross-talk between channels ct - -105 -80 db rg=0 ? , bw=ihf-a 21,22,25,26pin output input impedance rin 32 47 62 k ? 7 to 10pin volume maximum attenuation attmax - -115 -100 db volume=mute, bw=ihf-a vp-9690a(average value detection, effective value display) filter by panasonic is used for measurement.
7/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 typical performance curve(s) -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 012345678 vcc(+)/vee(-)[v] current[ma] figure 4. circuit currents vs. circuit voltage figure 5. volume gain vs. input frequency (32db to 0 db setting) operational range figure 6. volume gain vs. input frequency (0db to -32 db setting) figure 7. volume gain vs. input frequency (-32db to -64 db setting) -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 10 100 1000 10000 100000 frequency[hz] volume gain[db] -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 10 100 1000 10000 100000 fr eq uency[h z] volume gain[db] -66 -64 -62 -60 -58 -56 -54 -52 -50 -48 -46 -44 -42 -40 -38 -36 -34 -32 -30 10 100 1000 10000 100000 frequency[hz] volume gain[db]
8/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 -98 -96 -94 -92 -90 -88 -86 -84 -82 -80 -78 -76 -74 -72 -70 -68 -66 -64 -62 -60 10 100 1000 10000 100000 frequency[hz] v olum e gain[db ] 0.0001 0.0010 0.0100 0.1000 1.0000 0.001 0.010 0.100 1.000 10.000 input voltage [vrms] thd+n[%] figure 8. volume gain vs. input frequency (-64db to -95 db setting) figure 9. thd + n vs. input voltage 10khz 1 khz 100hz
9/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 specifications for control signal (1) timing of control signal data is read at a rising edge of clock. latch is read at a falling edge of clock. and data on the latest 16bit are taken in the inside of this ic. be sure to set da and cl to low after latching. 1byte=16bit item symbol limit unit min. typ. max. clock width twc 1.0 - - sec data width twd 1.0 - - sec latch width twl 1.0 - - sec low hold width twh 1.0 - - sec data setup time (data clk) tsd 0.5 - - sec data hold time (clk data) thd 0.5 - - sec latch setup time (clk latch) tsl 0.5 - - sec latch hold time thl 0.5 - - sec latch low setup time ts 0.5 - - sec latch low hold time th 0.5 - - sec (2) voltage of control signal (cl, da, chip) item conditions limit unit min. typ. max. ( 10/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 (4) table of control data input direction select addre ss no. d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 chip select 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 2 0 0 mute on/off l2,r2 0 0 0 0 mute on/off l1,r1 0 0 0 0 0 1 0 3 volume channel select volume 0 1 1 7 ab switch-time ba switch-time base clock 0 0 system reset 0 0 1 1 1 bd3843fs (6ch selector ic) * 1 0 0 bd3841fs (9ch selector ic) * 1 0 1 bd3812f (2ch volume ic) * 1 1 * ? serial control lines can be shared with bd34701ks2(8ch volume ic) to set different data by chip select. ? serial control lines can be shared with bd3843fs( 6ch selector ic), bd3841fs(9ch selector ic) and bd3812f(2ch volume ic). ? initialize all data at every turning on the power supply. (example) input direction address no.0 l address no.1 l address no.2 l address no.3 lch l address no.3 rch l address no.3 l1ch l address no.3 r1ch l address no.7 l ? at the second time after turning on the power supply, eight any data to be changed. (5) chip select setting table chip terminal condition d2 0 (low) 0 1 (high) 1 BD34700FV can be operated in combination with another by setting the chip terminal.
11/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.2 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 mute on/off l2,r2ch on 0 0 0 0 0 0 0 mute on/off l1,r1 0 0 0 0 0 chip select 1 0 off 1 mute on/off l1,r1ch on mute on/off l2,r2 0 off 1 : initial condition
12/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume channel select non select 0 0 0 volume 0 chip select 1 1 r2 0 1 0 l2 0 1 r1 1 0 l1 1 1 volume mute volume channel select 1 1 1 1 1 1 1 1 1 prohibition 1 1 1 1 1 1 1 0 . . . . . . . . . . . . . . . . 0 1 0 0 0 0 0 1 +32.0db 0 1 0 0 0 0 0 0 +31.5db 0 0 1 1 1 1 1 1 +31.0db 0 0 1 1 1 1 1 0 +30.5db 0 0 1 1 1 1 0 1 +30.0db 0 0 1 1 1 1 0 0 +29.5db 0 0 1 1 1 0 1 1 +29.0db 0 0 1 1 1 0 1 0 +28.5db 0 0 1 1 1 0 0 1 +28.0db 0 0 1 1 1 0 0 0 +27.5db 0 0 1 1 0 1 1 1 +27.0db 0 0 1 1 0 1 1 0 +26.5db 0 0 1 1 0 1 0 1 +26.0db 0 0 1 1 0 1 0 0 +25.5db 0 0 1 1 0 0 1 1 +25.0db 0 0 1 1 0 0 1 0 +24.5db 0 0 1 1 0 0 0 1 +24.0db 0 0 1 1 0 0 0 0 +23.5db 0 0 1 0 1 1 1 1 +23.0db 0 0 1 0 1 1 1 0 +22.5db 0 0 1 0 1 1 0 1 +22.0db 0 0 1 0 1 1 0 0 +21.5db 0 0 1 0 1 0 1 1 +21.0db 0 0 1 0 1 0 1 0 +20.5db 0 0 1 0 1 0 0 1 +20.0db 0 0 1 0 1 0 0 0 +19.5db 0 0 1 0 0 1 1 1 +19.0db 0 0 1 0 0 1 1 0 +18.5db 0 0 1 0 0 1 0 1 +18.0db 0 0 1 0 0 1 0 0 +17.5db 0 0 1 0 0 0 1 1 +17.0db 0 0 1 0 0 0 1 0 +16.5db 0 0 1 0 0 0 0 1 +16.0db 0 0 1 0 0 0 0 0 +15.5db 0 0 0 1 1 1 1 1 : initial condition
13/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume +15.0db volume channel select 1 0 0 0 1 1 1 1 0 0 chip select 1 1 +14.5db 0 0 0 1 1 1 0 1 +14.0db 0 0 0 1 1 1 0 0 +13.5db 0 0 0 1 1 0 1 1 +13.0db 0 0 0 1 1 0 1 0 +12.5db 0 0 0 1 1 0 0 1 +12.0db 0 0 0 1 1 0 0 0 +11.5db 0 0 0 1 0 1 1 1 +11.0db 0 0 0 1 0 1 1 0 +10.5db 0 0 0 1 0 1 0 1 +10.0db 0 0 0 1 0 1 0 0 +9.5db 0 0 0 1 0 0 1 1 +9.0db 0 0 0 1 0 0 1 0 +8.5db 0 0 0 1 0 0 0 1 +8.0db 0 0 0 1 0 0 0 0 +7.5db 0 0 0 0 1 1 1 1 +7.0db 0 0 0 0 1 1 1 0 +6.5db 0 0 0 0 1 1 0 1 +6.0db 0 0 0 0 1 1 0 0 +5.5db 0 0 0 0 1 0 1 1 +5.0db 0 0 0 0 1 0 1 0 +4.5db 0 0 0 0 1 0 0 1 +4.0db 0 0 0 0 1 0 0 0 +3.5db 0 0 0 0 0 1 1 1 +3.0db 0 0 0 0 0 1 1 0 +2.5db 0 0 0 0 0 1 0 1 +2.0db 0 0 0 0 0 1 0 0 +1.5db 0 0 0 0 0 0 1 1 +1.0db 0 0 0 0 0 0 1 0 +0.5db 0 0 0 0 0 0 0 1 prohibition 0 0 0 0 0 0 0 0 -0db 0 0 0 0 0 0 0 0 0 -0.5db 0 0 0 0 0 0 0 1 -1.0db 0 0 0 0 0 0 1 0 -1.5db 0 0 0 0 0 0 1 1 -2.0db 0 0 0 0 0 1 0 0 -2.5db 0 0 0 0 0 1 0 1 -3.0db 0 0 0 0 0 1 1 0 -3.5db 0 0 0 0 0 1 1 1 -4.0db 0 0 0 0 1 0 0 0 -4.5db 0 0 0 0 1 0 0 1 -5.0db 0 0 0 0 1 0 1 0 -5.5db 0 0 0 0 1 0 1 1 -6.0db 0 0 0 0 1 1 0 0 -6.5db 0 0 0 0 1 1 0 1 -7.0db 0 0 0 0 1 1 1 0 -7.5db 0 0 0 0 1 1 1 1
14/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume -8.0db volume channel select 0 0 0 0 1 0 0 0 0 0 chip select 1 1 -8.5db 0 0 0 1 0 0 0 1 -9.0db 0 0 0 1 0 0 1 0 -9.5db 0 0 0 1 0 0 1 1 -10.0db 0 0 0 1 0 1 0 0 -10.5db 0 0 0 1 0 1 0 1 -11.0db 0 0 0 1 0 1 1 0 -11.5db 0 0 0 1 0 1 1 1 -12.0db 0 0 0 1 1 0 0 0 -12.5db 0 0 0 1 1 0 0 1 -13.0db 0 0 0 1 1 0 1 0 -13.5db 0 0 0 1 1 0 1 1 -14.0db 0 0 0 1 1 1 0 0 -14.5db 0 0 0 1 1 1 0 1 -15.0db 0 0 0 1 1 1 1 0 -15.5db 0 0 0 1 1 1 1 1 -16.0db 0 0 1 0 0 0 0 0 -16.5db 0 0 1 0 0 0 0 1 -17.0db 0 0 1 0 0 0 1 0 -17.5db 0 0 1 0 0 0 1 1 -18.0db 0 0 1 0 0 1 0 0 -18.5db 0 0 1 0 0 1 0 1 -19.0db 0 0 1 0 0 1 1 0 -19.5db 0 0 1 0 0 1 1 1 -20.0db 0 0 1 0 1 0 0 0 -20.5db 0 0 1 0 1 0 0 1 -21.0db 0 0 1 0 1 0 1 0 -21.5db 0 0 1 0 1 0 1 1 -22.0db 0 0 1 0 1 1 0 0 -22.5db 0 0 1 0 1 1 0 1 -23.0db 0 0 1 0 1 1 1 0 -23.5db 0 0 1 0 1 1 1 1 -24.0db 0 0 1 1 0 0 0 0 -24.5db 0 0 1 1 0 0 0 1 -25.0db 0 0 1 1 0 0 1 0 -25.5db 0 0 1 1 0 0 1 1 -26.0db 0 0 1 1 0 1 0 0 -26.5db 0 0 1 1 0 1 0 1 -27.0db 0 0 1 1 0 1 1 0 -27.5db 0 0 1 1 0 1 1 1 -28.0db 0 0 1 1 1 0 0 0 -28.5db 0 0 1 1 1 0 0 1 -29.0db 0 0 1 1 1 0 1 0 -29.5db 0 0 1 1 1 0 1 1 -30.0db 0 0 1 1 1 1 0 0 -30.5db 0 0 1 1 1 1 0 1 -31.0db 0 0 1 1 1 1 1 0
15/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume -31.5db volume channel select 0 0 0 1 1 1 1 1 1 0 chip select 1 1 -32.0db 0 1 0 0 0 0 0 0 -32.5db 0 1 0 0 0 0 0 1 -33.0db 0 1 0 0 0 0 1 0 -33.5db 0 1 0 0 0 0 1 1 -34.0db 0 1 0 0 0 1 0 0 -34.5db 0 1 0 0 0 1 0 1 -35.0db 0 1 0 0 0 1 1 0 -35.5db 0 1 0 0 0 1 1 1 -36.0db 0 1 0 0 1 0 0 0 -36.5db 0 1 0 0 1 0 0 1 -37.0db 0 1 0 0 1 0 1 0 -37.5db 0 1 0 0 1 0 1 1 -38.0db 0 1 0 0 1 1 0 0 -38.5db 0 1 0 0 1 1 0 1 -39.0db 0 1 0 0 1 1 1 0 -39.5db 0 1 0 0 1 1 1 1 -40.0db 0 1 0 1 0 0 0 0 -40.5db 0 1 0 1 0 0 0 1 -41.0db 0 1 0 1 0 0 1 0 -41.5db 0 1 0 1 0 0 1 1 -42.0db 0 1 0 1 0 1 0 0 -42.5db 0 1 0 1 0 1 0 1 -43.0db 0 1 0 1 0 1 1 0 -43.5db 0 1 0 1 0 1 1 1 -44.0db 0 1 0 1 1 0 0 0 -44.5db 0 1 0 1 1 0 0 1 -45.0db 0 1 0 1 1 0 1 0 -45.5db 0 1 0 1 1 0 1 1 -46.0db 0 1 0 1 1 1 0 0 -46.5db 0 1 0 1 1 1 0 1 -47.0db 0 1 0 1 1 1 1 0 -47.5db 0 1 0 1 1 1 1 1 -48.0db 0 1 1 0 0 0 0 0 -48.5db 0 1 1 0 0 0 0 1 -49.0db 0 1 1 0 0 0 1 0 -49.5db 0 1 1 0 0 0 1 1 -50.0db 0 1 1 0 0 1 0 0 -50.5db 0 1 1 0 0 1 0 1 -51.0db 0 1 1 0 0 1 1 0 -51.5db 0 1 1 0 0 1 1 1 -52.0db 0 1 1 0 1 0 0 0 -52.5db 0 1 1 0 1 0 0 1 -53.0db 0 1 1 0 1 0 1 0 -53.5db 0 1 1 0 1 0 1 1 -54.0db 0 1 1 0 1 1 0 0 -54.5db 0 1 1 0 1 1 0 1
16/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume -55.0db volume channel select 0 0 1 1 0 1 1 1 0 0 chip select 1 1 -55.5db 0 1 1 0 1 1 1 1 -56.0db 0 1 1 1 0 0 0 0 -56.5db 0 1 1 1 0 0 0 1 -57.0db 0 1 1 1 0 0 1 0 -57.5db 0 1 1 1 0 0 1 1 -58.0db 0 1 1 1 0 1 0 0 -58.5db 0 1 1 1 0 1 0 1 -59.0db 0 1 1 1 0 1 1 0 -59.5db 0 1 1 1 0 1 1 1 -60.0db 0 1 1 1 1 0 0 0 -60.5db 0 1 1 1 1 0 0 1 -61.0db 0 1 1 1 1 0 1 0 -61.5db 0 1 1 1 1 0 1 1 -62.0db 0 1 1 1 1 1 0 0 -62.5db 0 1 1 1 1 1 0 1 -63.0db 0 1 1 1 1 1 1 0 -63.5db 0 1 1 1 1 1 1 1 -64.0db 1 0 0 0 0 0 0 0 -64.5db 1 0 0 0 0 0 0 1 -65.0db 1 0 0 0 0 0 1 0 -65.5db 1 0 0 0 0 0 1 1 -66.0db 1 0 0 0 0 1 0 0 -66.5db 1 0 0 0 0 1 0 1 -67.0db 1 0 0 0 0 1 1 0 -67.5db 1 0 0 0 0 1 1 1 -68.0db 1 0 0 0 1 0 0 0 -68.5db 1 0 0 0 1 0 0 1 -69.0db 1 0 0 0 1 0 1 0 -69.5db 1 0 0 0 1 0 1 1 -70.0db 1 0 0 0 1 1 0 0 -70.5db 1 0 0 0 1 1 0 1 -71.0db 1 0 0 0 1 1 1 0 -71.5db 1 0 0 0 1 1 1 1 -72.0db 1 0 0 1 0 0 0 0 -72.5db 1 0 0 1 0 0 0 1 -73.0db 1 0 0 1 0 0 1 0 -73.5db 1 0 0 1 0 0 1 1 -74.0db 1 0 0 1 0 1 0 0 -74.5db 1 0 0 1 0 1 0 1 -75.0db 1 0 0 1 0 1 1 0 -75.5db 1 0 0 1 0 1 1 1 -76.0db 1 0 0 1 1 0 0 0 -76.5db 1 0 0 1 1 0 0 1 -77.0db 1 0 0 1 1 0 1 0 -77.5db 1 0 0 1 1 0 1 1 -78.0db 1 0 0 1 1 1 0 0
17/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.3 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 volume -78.5db volume channel select 0 1 0 0 1 1 1 0 1 0 chip select 1 1 -79.0db 1 0 0 1 1 1 1 0 -79.5db 1 0 0 1 1 1 1 1 -80.0db 1 0 1 0 0 0 0 0 -80.5db 1 0 1 0 0 0 0 1 -81.0db 1 0 1 0 0 0 1 0 -81.5db 1 0 1 0 0 0 1 1 -82.0db 1 0 1 0 0 1 0 0 -82.5db 1 0 1 0 0 1 0 1 -83.0db 1 0 1 0 0 1 1 0 -83.5db 1 0 1 0 0 1 1 1 -84.0db 1 0 1 0 1 0 0 0 -84.5db 1 0 1 0 1 0 0 1 -85.0db 1 0 1 0 1 0 1 0 -85.5db 1 0 1 0 1 0 1 1 -86.0db 1 0 1 0 1 1 0 0 -86.5db 1 0 1 0 1 1 0 1 -87.0db 1 0 1 0 1 1 1 0 -87.5db 1 0 1 0 1 1 1 1 -88.0db 1 0 1 1 0 0 0 0 -88.5db 1 0 1 1 0 0 0 1 -89.0db 1 0 1 1 0 0 1 0 -89.5db 1 0 1 1 0 0 1 1 -90.0db 1 0 1 1 0 1 0 0 -90.5db 1 0 1 1 0 1 0 1 -91.0db 1 0 1 1 0 1 1 0 -91.5db 1 0 1 1 0 1 1 1 -92.0db 1 0 1 1 1 0 0 0 -92.5db 1 0 1 1 1 0 0 1 -93.0db 1 0 1 1 1 0 1 0 -93.5db 1 0 1 1 1 0 1 1 -94.0db 1 0 1 1 1 1 0 0 -94.5db 1 0 1 1 1 1 0 1 -95.0db 1 0 1 1 1 1 1 0 prohibition 1 0 1 1 1 1 1 1 . . . . . . . . . . . . . . . . 1 1 1 1 1 1 1 1
18/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 select address no.7 setting table function & setting d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 ab switching-time 11msec 0 0 0 ba switching-time base clock 0 0 system reset 0 0 1 chip select 1 1 5msec 0 0 1 7msec 0 1 0 14msec 0 1 1 3msec 1 0 0 2msec 1 0 1 prohibition 1 1 0 1 1 1 ba switching-time 11msec ab switching-time 0 0 0 5msec 0 0 1 7msec 0 1 0 14msec 0 1 1 3msec 1 0 0 2msec 1 0 1 prohibition 1 1 0 1 1 1 base clock x1 ba switching-time 0 1/2 1 system reset normal base clock 0 reset 1 : initial condition
19/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 volume changing needs the time that is follo wing figure. (ex. it selected 11msec, 22msec need.) figure 11. about [a b switching-time] [b a switching-time] base clock is able to change in ternal oscillator frequency. for exam ple, when base clock select 1/2, a->b and b->a switching time is to be two times. (ex. 11msec->22msec) caution on send data when send the same channel data among the switching process, internal operation is as below. figure 12. the switching process with send data data is sent during a -> b switching time, it is valid. data and data are sent during b -> a switching time, it is valid at the next processing time. but data is replaced by data. about pop noise in gain changing the level of the pop noise sometimes varies in the differ ence in output dc offset of the inside condition a and b. prossing time [a->b switching time] [b->a switching time] current xdb send ydb changed ydb clk data ic processing output initial invalid data initial processing time per 1 processing time per 1 a->b switching time b->a switching t ime a->b switching time b->a switching time
20/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 application circuit diagram figure 13. application circuit diagram notes on wiring gnd shall be wired from reference point and thicken. wiring pattern of cl and da shall be away from that of analog unit and cross-talk shall not be acceptable. lines of cl and da of shall not be parallel if possible. the lines shall be shielded, if they are adjacent to each other. please pay attention the wiring pattern of the input termina l of the input selector to the cross talk. recommend that wiring period is shielded. please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to vcc and gnd, vee. 1pin have to connect to 20-pin(vee), if you do n?t connect like as this note, ic may occurred ?latch-up or esd damaged?. chip vee 2200p 47 10 10 10 10 dgnd da cl vcc 2200p 47 vinl1 vinr1 vinl2 vinr2 voutl1 voutr1 voutl2 voutr2 +32db~95db 0.5db step >?>?>>?>? > >>? >?>? >y> >y>y >y>>y>? >y>t >y>? >y>a >y>? >y>? >t> >t>y >t>t >t> >t>a >t>? >t>? >?> >t>? >?>y >?>t >?> >?>? >y
21/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 power dissipation about the thermal design by the ic characteristics of an ic have a great deal to do with the tem perature at which it is used, and exceeding absolute maximum ratings may degrade and destroy elements. careful considerat ion must be given to the heat of the ic from the two standpoints of immediate damage and lo ng-term reliability of operation. figure 14. temperature derating curve note) value is actual measurements and is not guaranteed. power dissipation values vary according to the board on which the ic is mounted. reference data ssop-b40 2.0 1.0 0.0 0 25 50 75 100 125 150 ambient temperature ta(c) power dissipation pd(w) 1.12w ja = 111.1c/w 85 measurement condition: rohm standard board board size 70701.6( ?) material a fr4 grass epoxy board (3% or less of copper foil area)
22/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 vee vcc vee vcc vee vcc i/o equivalence circuit(s) terminal number terminal name terminal voltage (v) equivalent circuit description of terminal 1 vees -7 negative power supply terminal 4 5 11 12 13 27 28 29 30 31 32 33 34 agnd 0 analog ground terminals. 16 20 vcc vee +7 -7 positive power supply terminal and negative power supply terminal 17 dgnd 0 digital ground terminal. 18 19 14 da cl chip - input terminals for a clock and data. 21 22 25 26 voutr2 voutl2 voutr1 voutl1 0 output terminals for analog sound signal. vcc vee vcc vee
23/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 terminal number terminal name terminal voltage (v) equivalent circuit description of terminal 7 8 9 10 vinl1 vinr1 vinl2 vinr2 0 input terminals for stereo sound signal. input impedance is 47k ? (typ.). 2 3 23 24 37 38 39 40 test 0 test terminals vcc ve e 47k
24/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. vee voltage ensure that no pins are at a voltage below that of the vee pin at any time, even during transient condition. 4. ground wiring pattern gnd pins which are digital ground(17pin) and analog ground(4,5,11,12,13, 27,28,29,30,31,32,33, 34pin) are not connected inside lsi. these ground pins traces should be routed separately but connected to a single ground at the reference point of the application board. also ensure that the gr ound traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epox y board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application boar d, connecting a capacitor directly to ic pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspecti on process. to prevent damage from static discharge, ground the ic during assembly a nd use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals because the input impedance of the terminal becomes 47k ? when the signal input terminal makes a terminal open, the plunge noise from outside sometimes becomes a pr oblem. please connect the no using input pin to gnd. and please open the no using output pin.
25/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 operational notes ? continued 1 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when vee > pin a and vee > pin b, the p-n junction operates as a parasitic diode. when vee > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the vee voltage to an input pin (and thus to the p substrate) should be avoided. figure 15. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the c hange of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. about power on/off 1. at power on/off, a pop sound will be gener ated and, therefore, use mute on the set. 2. when turning on power supplies, vee and vcc should be powered on simultaneously or vee first; then followed by vcc. if the vcc side is started up first, an excessive current may pass vcc through vee. 15. about function switching when switching input selector, mode selector or input gain, use mute on volume. 16. volume gain switching in case of the boost of the volume when changing to t he high gain which exceeds +20db especially, the switching pop noise sometimes becomes big. in this case, we recommend changing every 1 db step without changing a gain at once. also, the pop noise sometimes can reduce by ma king micro-step volume switching time long, too. nn p + p n n p + p substrate vee n p + n n p + n p p substrate vee vee parasitic elements pin a pin a pin b pin b bc e parasitic elements vee parasitic elements c b e transisto r ( npn) resisto r n region close - by parasitic elements
26/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 operational notes ? continued 2 17. output load characteristic the usages of load for output are below (refe rence). please use the load more than 10 k ? (typ). output terminal terminal no. terminal name terminal no. terminal name 21 voutr2 25 voutr1 22 voutl2 26 voutl1 figure 16. output load characteristic at vcc=+7v, vee=-7v(reference) 18. about test and n.c pins treatment about the next pin of the test and nc des ignator, please handle it as follows pin number how to countermeasure 2,3,37,38,39,40 short to gnd 6,15,23,24,35,36 open (none connection) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 100 1000 10000 100000 load resistance v o,max vrms vcc=+7v vee=-7v thd+n=1% bw=400 30khz
27/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 ordering name selection b d 3 4 7 0 0 f v e 2 part number package fv: ssop-b40 tape and reel information e2: reel type embossed taping (ssop-b40) physical dimension tape and reel information marking diagram (unit : mm) ssop-b40 0.08 m 0.1 s 0.22 0.1 0.65 0.15 0.1 0.5 0.2 7.8 0.3 5.4 0.2 1.8 0.1 0.1 1 40 20 21 13.6 0.2 (max 13.95 include burr) ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin ssop-b40(top view) BD34700FV part number marking lot number 1pin mark
28/27 datasheet datasheet BD34700FV ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0c2c0e100060-1-2 06.aug.2014 rev.001 revision history date revision changes 6.aug.2014 001 new release
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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